Connect with us

Tech

US Tightens Grip On China With New Chip Restrictions

Published

on

US Tightens Grip On China With New Chip Restrictions

The latest developments around U.S.-China relations have taken another significant turn, particularly impacting the semiconductor industry. On December 2, 2024, the Biden administration announced sweeping new trade restrictions aimed at China’s growing chipmaking capabilities, intensifying the already fierce tech rivalry between the two nations. This latest round of restrictions is seen as one of the most comprehensive yet, reflecting deep-rooted concerns over national security and military advancements stemming from technological progress.

These restrictions, carried out by the U.S. Commerce Department’s Bureau of Industry and Security, come on the heels of the successful launch of Huawei’s Mate 70 series, which features cutting-edge technology believed to have breached previously held restrictions. The announcement involves restrictions on 24 categories of semiconductor manufacturing equipment as well as three types of software necessary for chip development. The main target of these new regulations is high-bandwidth memory (HBM) technology, which is key for advanced applications including artificial intelligence (AI).

Continue Reading